CFT Capitals is advancing AI utilization around the world
through the manufacture of System on a Chip IC.
A system on a chip (SoC) is an integrated circuit that combines all essential components of a computer
or other electronic system—like a central processing unit (CPU), memory, and graphics processing unit (GPU)
onto a single chip. This integration makes devices smaller, more power-efficient, and faster by eliminating
the need for multiple separate chips. SoCs are commonly found in smartphones, tablets, and embedded systems,
as well as increasingly in laptops and servers.
Key components of an SoC
Central Processing Unit (CPU): The main processing unit that handles the primary computations.
Graphics Processing Unit (GPU): Handles visual processing and rendering for display output.
Memory: Includes various types like RAM, ROM, and flash memory for storing data and code.
Input/Output (I/O): Interfaces for connecting to external devices, such as USB ports.
Other elements: Can include digital signal processors (DSP), wireless communication modules (like Wi-Fi and Bluetooth),
and other application-specific circuits.
Benefits of using an SoC
Miniaturization:
Integrating multiple components into one chip allows for smaller, more compact products.
Power efficiency:
Co-locating components reduces the distance signals need to travel, leading to lower power consumption.
Performance:
Higher data transfer rates and faster communication between components result in improved performance.
Cost-effectiveness:
Reduces the cost of manufacturing and assembly compared to using multiple separate chips.
Examples of applications
Mobile devices: Powering the wide range of functions in smartphones and tablets.
Automotive systems: Used in infotainment, navigation, and advanced driver-assistance systems (ADAS).
Embedded systems: Integrated into countless devices, from cameras to wireless technology.
Fabrication
CFT Capitals is pleased to announce the expansion of our production facilities on a 445 acre industrial site
in North Carolina. We will be adding over 2 million sq. ft. of production capacity.
We have also contracted for 4 new ASML chip fabrication machines for delivery during the summer of 2026.
This gives us the ability to make 2 nm chips in our new facility.
The most complicated machine on the planet, made by ASML
Please contact Kenneth Corrao, CEO for further information
click here
